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NEPCON JAPAN 2026
INTERNEPCON JAPAN
IC & Sensor Packaging Technology Expo
Power Device & Module Expo
Automotive Electronics Tech & Sensors
Electrotest Japan & PWB Expo
ASIA’S LEADING ELECTRONICS MANUFACTURING, PACKAGING & SMT TECHNOLOGY B2B GATEWAY ARRIVES AT MAKUHARI MESSE!
Organized by RX Japan Ltd., the landmark 5th Edition of NEPCON JAPAN [September] 2026 brings together over 1,000+ global exhibitors, 35,000+ industry engineers, automotive OEM designers, semiconductor technologists, and electronics manufacturing leaders from across the globe!
Hosted across the massive international halls of Makuhari Messe in Chiba/Tokyo, Japan, this premier 3-day international B2B technical exhibition serves as Asia’s central platform showcasing cutting-edge SMT equipment, IC packaging technologies, printed circuit boards (PCBs), electronic components, and advanced power electronics!
📅 Dates: Wednesday, September 09 – Friday, September 11, 2026
⏰ Hours: 10:00 AM – 5:00 PM Daily
📍 Venue: Makuhari Messe, 2-1 Nakase, Mihama-ku, Chiba-shi, Chiba 261-0023, Japan
🎯 Target Audience: SMT & Assembly Engineers, Semiconductor Packaging Specialists, PCB Designers, Automotive Electronics Engineers, Quality Control Managers, R&D Technologists, Plant Automation Leads, and Procurement Directors.
✨ Key Specialized Shows & Exhibition Highlights:
🖥️ INTERNEPCON JAPAN: Surface Mount Technology (SMT), automated soldering machinery, inspection/testing equipment, and electronic manufacturing services (EMS).
📦 IC & Sensor Packaging Technology Expo: Advanced semiconductor packaging substrates, bonding tools, encapsulation materials, wafer-level testing, and MEMS packaging.
⚡ Power Device & Module Expo: Next-gen SiC/GaN power semiconductors, thermal management materials, power conversion modules, and high-voltage testing systems.
🏎️ Automotive Electronics Tech & Sensors: Vehicle ECU systems, ADAS sensor packaging, EV powertrain electronics, microcontrollers, and harness assembly tech.
🔌 Electrotest Japan & PWB Expo: High-density multilayer PCBs, flexible printed circuits (FPC), optical inspection platforms, and high-frequency circuit materials.
🤝 Technical Conferences, Keynote Sessions & B2B Sourcing: Attend high-level technical seminars presented by global semiconductor and electronics leaders, explore live demonstration lines for next-gen surface mount production, and connect directly with Asian OEM/ODM manufacturing suppliers!
Discover the future of high-precision electronics manufacturing live, source factory-direct components, and scale your technical hardware capabilities!
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